Fast Thermal Cycling-Enhanced Electromigration in Power Metallization

Effects of thermal cycling on aluminum metallization of power diodes

Thermal Impedance Monitoring during Power Cycling Tests

In this publication a new method of thermal impedance analysis of power modules is presented. It enables a distinction of different failure mechanisms within the heat flow path by electrical measurement during power cycling tests. With measurement and evaluation of the thermal impedance Zth the degradation can be located within chip solder layer, system solder layer and thermal interface materi...

Fast Thermal Cycling Stress and Degradation in Multilayer Interconnects

The thermal cycling stress method is popularly used to study the thermal mechanical effect on metallization films in VLSI applications, specially in interconnect systems of power IC. The fast thermal cycling stress method reported in this paper has several advantages compared with using a conventional oven for thermal stress. A special test chip is designed to demonstrate the application of thi...

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric

0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.021 ⇑ Corresponding author at: STMicroelectronics, 8 Crolles, France. Tel.: +33 4 38 92 27 30. E-mail address: [email protected] (T. Frank). In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies. First part presents an exhaustive analysis of Cu TSV-la...

Failure mechanisms and reliability of the Al-chip- metallization during power cycling

This paper studies the failure mechanisms and the reliability of the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests and thermo-mechanical Finite Elements simulations are performed. This study takes advantages of the numerical simulations to analyze in details plastic strains and crack gr...